Martin J. Crippen IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (crippen@us.ibm.com). Mr. Crippen is a Senior Technical Staff Member in IBM eServer Power, Packaging, and Cooling Development. He received a B.S. degree in mechanical engineering from the Rochester Institute of Technology in 1983 and an M.S. degree in mechanical engineering from Binghamton University in 1994. His experience ranges from the development of mainframe computers to open-system VME computers. Mr. Crippen's field of specialty is electronics packaging, including card-on-board and server-level and rack-level packaging. He is well versed in system cooling and power system architecture. He has been instrumental in the development of many IBM Netfinity* and xSeries servers and is the lead mechanical engineer for the IBM eServer BladeCenter system. Mr. Crippen holds numerous patents in electronics packaging and cooling.

Roland K. Alo IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (aloha@us.ibm.com). Mr. Alo is a Senior Industrial Designer in the IBM Systems and Technology Group. He received a B.F.A. degree in industrial design from Brigham Young University in 1987. He has been instrumental in the design development of the PC Server, IBM Netfinity, and xSeries, and he is the industrial designer for the IBM eServer BladeCenter system. He holds many international design awards. In 2003, the BladeCenter system received awards at Industrie Forum in Hanover, Germany, and at SMAU Industrial Design in Italy. Mr. Alo has authored or coauthored several design patents.

David Champion IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (dchamp@us.ibm.com). Dr. Champion is a Senior Technical Staff Member who leads a human factors team that specializes in hardware usability: that is, ease of installation, service, and upgrades. He is one of the originators of light-path diagnostics, and he has been a major influence in enabling customer-replaceable units in products. Dr. Champion received a B.S. degree in economics from London University, an M.S. degree in ergonomics from Loughborough University (U.K.), and a Ph.D. degree in psychology from North Carolina State University. He also has a postgraduate diploma in education from Nottingham University (U.K.). He joined IBM in 1989. Dr. Champion holds several patents.

Raymond M. Clemo IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (clemo@us.ibm.com). Mr. Clemo is a Senior Engineer in IBM eServer Power, Packaging, and Cooling Development. He received a B.S. degree in engineering (magna cum laude) from the University of Central Florida in 1977. He joined the Power Group at IBM Boca Raton and has worked since then in power design, development, and test. He joined xSeries Power Systems in September 1998, becoming department lead engineer. His current responsibilities include authoring and maintaining the power section of the xSeries Hardware Design Guide. He is a member of the xSeries CBB and System Development Councils. Mr. Clemo has received the IBM First Plateau Invention Achievement Award.

Cynthia M. Grosser IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (grosserc@us.ibm.com). Mrs. Grosser is a manager of server mechanical development in IBM eServer Power, Packaging, and Cooling Development. She received a B.S. degree in mechanical engineering with a minor in engineering mechanics, and an M.S. degree in mechanical engineering from Pennsylvania State University in 1994 and 1996, respectively. She was the mechanical engineering leader for the key teams that designed the first IBM 1U and 2U servers. She created the Mechanical Peer Design Review team for the xSeries brand. Mrs. Grosser holds several patents in mechanical packaging, some of which pertain to hot-plug PCI.

Nickolas J. Gruendler IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (njg@us.ibm.com). Mr. Gruendler is a Senior Engineer in IBM eServer Power, Packaging, and Cooling Development. He received a B.S. degree, with honors, in mechanical engineering from the University of Missouri at Columbia in 1977, and an M.S. degree in electrical engineering from the University of Kentucky at Lexington in 1985. He joined IBM at Lexington in 1977. His most recent assignment is in Research Triangle Park working on xSeries power systems, where he is the lead power engineer for the BladeCenter system. He has been a member of the Power Development Council since 1997 and chairman since 2000. Mr. Gruendler has authored or coauthored several patents and technical bulletin disclosure publications.

Mohan S. Mansuria IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (mansuri@us.ibm.com). Mr. Mansuria is a Senior Engineer in Thermal Technology and Development. He received an M.S. degree in mechanical engineering from North Carolina State in 1966 and an M.S. degree in operations research from Union College in 1976. He has more than 30 years of experience in air and water cooling in first-, second-, and third-level packages in IBM systems. Mr. Mansuria holds more than 15 patents in electronic packaging and cooling technologies. He currently works on the thermal design of xSeries DP and MP servers.

Jason A. Matteson IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (mattesj@us.ibm.com). Mr. Matteson received an A.S. degree in engineering science from the State University of New York at Alfred in 1994 and a B.S. degree in mechanical engineering from the Rochester Institute of Technology in 1997. He began his professional career with IBM as a mechanical engineer, supporting the mechanical development team with system and hardware design. He received an IBM Outstanding Technical Achievement Award for the thermal design and support of the first 1U, dual-P4 Intel Xeon** servers. He supports IBM key customers with data-center cooling concerns and issues resulting from ultra-dense server deployments. Mr. Matteson has authored or coauthored several patents and technical bulletin disclosure publications.

Michael S. Miller IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (msmiller@us.ibm.com). Mr. Miller is a Senior Technical Staff Member supporting xSeries power, packaging, and cooling. His current assignment is as an architect defining and developing future server products and building blocks. He graduated from the University of Florida in 1978 with a B.S.M.E. degree. Mr. Miller has been heavily involved in defining industry standards such as ISA, MicroChannel, PCI, PCMCIA, InfiniBand, PCI-Express**, SIOM, and planar, media, power-supply, and drive form factors. For the last nine years he has been a member of what is now xSeries development and was heavily involved in defining the BladeCenter system. Mr. Miller holds numerous patents and has achieved his third-level invention plateau.

Brian A. Trumbo IBM Systems and Technology Group, 3039 Cornwallis Road, Research Triangle Park, North Carolina 27709 (batrumbo@us.ibm.com). Mr. Trumbo is an Advisory Engineer in IBM eServer Power, Packaging, and Cooling Development. He joined IBM in 1978 as an apprentice tool and model maker with the SEDAB organization in Boca Raton, Florida, and in 1982 moved to the IBM Personal Computer Group. He has 26 years of mechanical engineering, design, and tooling experience with many computing systems. Mr. Trumbo participates as an active member of the IBM RTP Patent Review Board and the RTP PP&C Mechanical Peer Design Review Council. He has been recognized with several IBM awards, holds numerous IBM patents, and is recognized as an IBM RTP Master Inventor.

*Trademark or registered trademark of International Business Machines Corporation.
**Trademark or registered trademark of InfiniBand Trade Association, Intel Corporation, Flomerics Ltd., Fluent Inc., Innovative Research, Inc., or PCI-SIG Corporation in the United States, other countries, or both.