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Volume 46, Number 6, 2002
System-on-a-Chip and Packaging |
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Table of contents:
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This article:
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Land grid array sockets for server applications - References
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by
J. S. Corbin, C. N. Ramirez, and D. E. Massey
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References
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P. J. Brofman, K. J. Puttlitz, and R. N. Master, “Hard Ball Grid Arrays for Pluggable BGA Connector,” Proceedings of the International Society for Optical Engineering, Vol. 2649, 1995, pp. 1–6.
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B. Chan and P. Singh, “BGA Sockets—A Dendritic Solution,” Proceedings of the 46th IEEE Electronic Components and Technology Conference, 1996, pp. 460–466.
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Rao R. Tummala and Eugene J. Rymaszewski, Eds., Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989, pp. 1–64.
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John H. Lau, Ed., Solder Joint Reliability, Theory and Applications, Van Nostrand Reinhold, New York, 1991.
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W. L. Brodsky, A. D. Knight, and T. Macek, “Featured Elastomer Design for Connector Applications,” Proceedings of the 43rd IEEE Electronic Components and Technology Conference, 1993, pp. 465–467.
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D. Crotzer, D. DeDonato, J. Goodwin, and A. Michaud, “Metalized Particle Interconnect,” Proceedings of the Connector and Interconnection Symposium, Anaheim, CA, 1997, pp. 355–378.
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CIN::APSE®
High Density Interconnect Technology, product brochure, Labinal Components and Systems, Inc., 1500 Morse Avenue, Elk Grove Village, IL 60007.
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B. Beaman, D. Shih, and G. Walker, “Elastomeric Connector for MCM and Test Applications,”
Proceedings of SPIE—The International Society for Optical Engineering, Vol. 1986, 1993, pp.
341–346.
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cLGA®
Land Grid Array Socket System, product brochure, InterCon Systems, Inc., 2800 Commerce Drive, Harrisburg, PA 17110.
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S. Williams and J. Tustaniwskyj, “Stress Analysis of a C4 Land Grid Array Package,” Proceedings of the International Intersociety of Electronic Packaging Conference, Electrical and Electronic Packaging Division of ASME, Vol. 10-1, 1995, pp. 403–408.
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J. P. Den Hartog, Advanced Strength of Materials, McGraw-Hill Book Co., Inc., New York, 1952, pp. 141–170.
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M. Hetenyi, Beams of Elastic Foundation, University of Michigan Press, Ann Arbor, MI, 1946.
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Y. Ling, “Stress Analysis of a Compressed Elastomeric Connector Spring,” Proceedings of the 47th IEEE Electronic Components and Technology Conference, 1997, pp. 890–897.
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