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by H. Harrer, H. Pross, T.-M. Winkel, W. D. Becker, H. I. Stoller, M. Yamamoto, S. Abe, B. J. Chamberlin, and G. A. Katopis |
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References
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G. A. Katopis and W. D. Becker, “S/390 Cost Performance Considerations for MCM Packaging Choices,” IEEE Trans. Components, Packaging, Manuf. Technol., Part B: Adv. Packaging 21, No. 3, 286–297 (August 1998).
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J. M. Hoke, P. W. Bond, T. Lo, F. S. Pidala, and G. Steinbrueck, “Self-Timed Interface for S/390 I/O Subsystem Interconnection,” IBM J. Res. & Dev. 43, No. 5/6, 829–846 (September/November 1999).
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B. Garben and M. F. McAllister, “Novel Methodology for Mid-Frequency Delta-I Noise Analysis of Complex Computer System Boards and Verification by Measurements,” Proceedings of the 9th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, 2000, pp. 69–72.
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H. H. Smith and G. A. Katopis, “Multireflection Algorithm for Timed Statistical Coupled Noise Checking,” IEEE Trans. Components, Packaging & Manuf. Techn. 19, 503–511 (August 1996).
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