|
Within the past decade CMOS has become the technology of choice for a
broad range of semiconductor products. High-density DRAMs, high-speed
processors, and low-power devices for mobile applications are key
examples. Underlying this widespread appeal are the distinguishing
advantages that CMOS provides: an exceptionally low power-delay product,
the ability to accommodate millions of devices on a single chip, and
flexible, custom design methodologies which permit optimization, as
required, for lowest cost, lowest power, or highest speed.
Accompanying the versatility of CMOS is the economy of providing support
for a single technology, rather than for a collection of several
disparate ones.
This issue of the IBM Journal of Research and Development
is a collection
of papers on IBM CMOS technology which illustrates this breadth of
application and describes the increasing sophistication that is present
in the underlying design tools and fabrication techniques.
The opening papers, by Sechler and Grohoski,
describe the impact of CMOS
on the system design of high-performance processors such as those used in
IBM's RISC System/6000 workstation family.
Following these are several papers describing chip designs which together
demonstrate the flexibility of CMOS in providing superior solutions to
applications that traditionally required much more disparate supporting
device technology. Included are contributions by
Bernstein et al.,
describing the trade-off of power for performance in the IBM 601 PowerPC
chip, and two papers which show the versatility of CMOS DRAM cores
surrounded by application-specific circuitry. The first, by
Sunaga et al.,
is on a wide-I/O (64Kb x 32) chip for graphics applications; the
second, by Ellis et al.,
demonstrates the flexibility in DRAM
applications that can be offered to system designers. The use of CMOS in
applications at the interface between technically conflicting signal
regimes, such as photonics and analog, is illustrated in the next three
papers, by Kuchta et al.
on CMOS photodetector/preamplifiers, by Ewen et al.
on CMOS-based custom circuits for high-speed data communication, and
by Shin et al.
on the design of a custom low-power, high-performance
CMOS-based digital signal-processing circuit. Closing the section on
chip design are a paper by Bechade and Houle,
which presents a technique
for clock multiplication, and a paper by
Dhong et al., which describes a
circuit for providing a low-noise CMOS TTL-compatible off-chip driver.
Design automation tools have had to keep pace with the increasing
complexity and diversity of CMOS applications, as described in the next
three papers. Bose and Surya
present techniques for a structured
approach to timing verification in high-speed RISC processors.
Bergamaschi et al.
describe a now commercially available method for
synthesizing gate-level networks from a high-level functional
description. Kuehlman et al.
describe a formal verification program for
confirming the equivalence of CMOS transistor-level designs and their
high-level functional specification.
Today's CMOS technology is the result of several decades of evolution,
illustrated by the papers in the final section.
Adler et al. describe
the influence provided by DRAMs in this evolutionary process.
Chesebro et al.
discuss the complexity of channel-length control across large
chips, an effect which can seriously limit chip performance. The next
two papers speak to the current state of the production art:
Leonovich et al.
describe the process by which a modern silicon production facility
learns, and Koburger et al.
describe how the base technology provided by
DRAMs is extended to provide the features needed for high-performance,
low-power logic applications at 2.5 volts. Finally, the extendibility of
CMOS is examined in two papers which explore the fringes of today's
capabilities: Shahidi et al.
take a look at the implications of
providing a CMOS technology which operates at 1 volt, and
Taur et al.
show results recently realized in fabricating CMOS transistors at channel
lengths of 100 nm and less.
This issue was brought together by the diligent effort of the following
individuals: Peter Cottrell, James Dunn, J. Michael Hancock, Tak Ning,
Rosemary Previti-Kelly, W. David Pricer, Robert Sechler, and Lewis
Terman, who identified and solicited the papers as well as many of the
peer reviewers. We are grateful as well to Karen Papo, who provided
invaluable and responsive administrative support. Finally, we
acknowledge all those who make up the IBM CMOS technology team. Their
contributions are, of necessity, only partially represented by the papers
in this issue.
Daniel J. Fleming
Guest Editor
Editor's note:
The editors gratefully acknowledge the leadership of guest
editor Daniel Fleming in the planning and development of this issue.
Formerly Director of Development for the IBM Microelectronics Division
and now retired from IBM, Dan identified and recruited the steering
committee, organized the subject matter as he has described it above,
obtained the commitment and support of executive management, and provided
direction, motivation, and encouragement to all of us.
|