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6th International Symposium
Magnetic Materials, Processes and Devices
Applications to Storage and Microelectromechanical Systems (MEMS)
Editors
S. Krongelb
Research Staff Member Emeritus
IBM T.J. Watson Research Center
Yorktown Heights, New York
L.T. Romankiw
IBM T.J. Watson Research Center
Yorktown Heights, New York
J.-W. Chang
Headway, Inc.
Milpitas, California
W. Schwarzacher
University of Bristol
Bristol, United Kingdom
C.H. Ahn
Department of Electrical & Computer Engineering and Computer Science
University of Cincinnati
Cincinnati, Ohio
ELECTRODEPOSITION DIVISION
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Proceedings Volume PV 2000-29
Published by:
The Electrochemical Society, Inc.
65 South Main Street
Pennington, New Jersey 08534-2896, USA
Copyright 2001 by The Electrochemical Society, Inc. All rights reserved.
To order this Proceedings, click here.
TABLE OF CONTENTS
| Conference Organization |
xi |
| | |
Section I Storage: Business and Technology Overview |
1 |
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| 1. Magnetic Recording: Challenges and Opportunities J. Best, V. Marrello |
3 |
| | | |
2. The Disk Drive Industry's Dynamic Past J.N. Porter |
19 |
| | | |
3. Magnetic Recording Heads for 60 Gb/in2 and Beyond F.H. Liu, K. Stoev, X. Shi, H.C. Tong, M. Gibbons, M. Re |
34 |
| | | |
4. On The Road to 100 Gb/in2 - Advanced High Performance Media M. Russak |
45 |
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5. Review of Thin-Film Write Heads for High Data Rate Recording Y. Hsu, K Klaassen |
52 |
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Section II Magnetic Disks |
61 |
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6. Directions in Disk Drive Tribology: Laser Texture and Beyond P.M. Baumgart, A.C. Tam |
63 |
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7. Advanced Media for Extremely High-Density Longitudinal Magnetic Recording B.R. Acharya, E.N. Abarra, A. Inomata, I. Okamoto |
69 |
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8. Molecular Conformation and Tribology Performance of Perflouropolyether Lubricant L.J. Huang, P. Henry, S. Chang |
84 |
| | | |
9. Magnetic Properties of Nickel-Phosphorus Deposits with Controllable Phosphorus Contents Prepared by Electrodeposition C.-C. Hu, A. Bai |
93 |
| | | |
Section III Electrodeposited Magnetic Nanostructures |
99 |
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10. Patterned Electrodeposition of CoPt Micromagnets P. Evans, I. Zana, G. Zangari |
101 |
| | | |
11. Fabrication and Magnetic Properties of Arrays of Electrodeposited Cylinders M. Shima, M. Hwang, M. Farhoud, T.A. Savas, A. Tkaczyk, J.U.C. Parrochon, W. Escoffier, H.I. Smith, C.A. Ross, W. Schwarzacher |
111 |
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12. Magnetic Anisotropy Phenomena in Electrodeposited Heterostructure Devices K. Attenborough, L. Perez-Garcia, M. Cerisier, J.-P. Celis, J. De Boeck |
125 |
| | | |
13. Electrodeposition of Co Thin Films and Co/Cu Spin-Valves on Silicon A.A. Pasa, M.L. Munford, E Voltolini, L. Seligman, M. Sardela, M.L. Sartorelli |
137 |
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14. Ultrathin Electrodeposited Magnetic Films: Relevant for Magnetoelectronic Applications? W. Schindler, Th. Koop, J. Kirschner |
148 |
| | | |
15. Electrodeposited GMR Co/Cu Multilayers N.V. Myung, B.Y. Yoo, M Schwartz, K Nobe |
154 |
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Section IV Plated Materials for Magnetic Heads |
165 |
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16. Fabrication of High-Bs Soft Magnetic Thin Films by an Electrodeposition Technique for Next-Generation Magnetic Recording Field T. Osaka, T. Yokoshima, T. Nakanishi |
167 |
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17. Pulsed Electrodeposition of Soft Magnetic CoNiFe Thin Films T. Nakanishi, M. Ozaki, H.-S. Nam, T. Yokoshima, T. Osaka |
176 |
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18. The Effect of Preparation Conditions on the Magnetic Properties of Electroplated High-Bs CoNiFe Films M. Saito, N. Ishiwata, K. Ohashi |
185 |
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19. The Structural and Magnetic Properties of Pulsed Current Electrodeposited Co and Co-Ni Alloy Films K. Maruyama, A. Matsushita, M. Imai, H. Numata, O. Nittono |
197 |
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20. Magnetic Properties and Corrosion Resistance of Electrodeposited Fe-Co-Ni Alloys X. Liu, G. Zangari |
211 |
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21. Electrodeposition of Soft CoNiFe, CoNiFeO and CoFeO Films with High Magnetic Saturation and High Resistivity I. Tabakovic, V. Inturi, S. Riemer, A. Morrone, P. Jallen |
220 |
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22. Morphology of Soft Magnetic CoNiFe Films Electrodeposited in the Presence of Saccharin and Sodium Lauryl Sulfate I. Tabakovic, V. Inturi, S. Riemer, P. Jallen, P. McGeehin |
231 |
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| 23. Corrosion Behavior of Electrodeposited Soft Magnetic NiFe, CoNiFe, CoNiFeO and CoFe Alloys S. Riemer, I. Tabakovic, V. Inturi, P. Jallen |
241 |
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24. Origin of Inclusion of Foreign Elements During the Electrodeposition of Soft Magnetic NiFe, CoNiFe, and CoNiFeO Alloys: SIMS and XPS Analysis I. Tabakovic, S. Riemer, R. Kvitek, P. Jallen, V. Inturi |
253 |
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25. Electroplated CoFeCu Films in Write Heads: Plating and Magnetic Evaluation E.I. Cooper, Y. Hsu, L.T. Romankiw, J.G. McCord, V. Nikitin |
264 |
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26. Magnetic Properties of Copper Laminated Magnetic CoFeCu Films Deposited from a Single Plating Bath by Current Modulation P. Trouilloud, L.T. Romankiw, J.-W. Chang, K.C. Lin |
276 |
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27. Influence of Phosphorus on the Corrosion Properties of Electrodeposited CoFeCu Soft Magnetic Thin Films R. Bell, E.E. Kalu |
287 |
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28. Micro-Pattern Formation for Magnetic Recording Heads Using Electroless CoFeB Deposition T. Yokoshima, S. Nakamura, D. Kaneko, T. Osaka, S. Takefusa, A. Tanaka |
297 |
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29. Electrodeposited CoP: Structural and Magnetic Properties W. Ruythooren, E. de Wit, J. De Boeck, J.-P. Celis |
309 |
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Section V Magnetic Structures, Fabrication and Properties |
317 |
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30. The Impact of Resolution Enhancement Technology on TFH Industry L. Tong |
319 |
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31. Nanometer Trackwidth Definition by E-Beam Lithography for Advanced Magnetic Recording Heads K. Lin, J.-W. Chang, Z. Cui, K. Ju, S. Araki |
332 |
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32. Focused Ion beam Production Micromachining of Magnetic Head Write Poles B. Miller, R. Lee, D. Hahn, G. Brown, A. Zahler |
343 |
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33. Submicron Write Track Fabrication Using RIE and KrF Excimer Laser Stepper T. Okada, N. Yoshida, K. Etoh, I. Nunokawa, M. Fuyama, T. Kawabe |
348 |
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34. Composition and Plating Rate Variations in Narrow Pole Tips for Write Heads T. Dinan, J.A. Katine, P. Rice |
359 |
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35. Micromagnetic Computer Simulation of Ultra-High Density Recording with the Use of a Planar-Type Head S.H. Lim, H. Takano, K. Yoshida |
366 |
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36. The Use of CMP in Making Computer Read/Write Heads P.B. Phipps, F.H. Dill, F.O. Eschbach, E. Lee, F. Martin |
381 |
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37. Temperature Distribution and Its Impact on Reliability of MR/GMR Heads C.T. Lin, S. Kao, J.-W. Chang |
389 |
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38. Structural Properties and Electrical Resistivity of Sputter-Deposited Co-Sm-Co Trilayers K. Tanahashi, M. Kawahara, N. Taguchi, T. Sugimoto, K. Motoi |
396 |
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39. High Frequency Measurements of Magnetic Films D. Olsen, P. Koonath, T. Yeh, Z. Qian, D. Wang, R.F. Drayton, J. Sivertsen, A. Gopinath |
404 |
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40. Design and Characteristics of a Wafer-Scale Uniform Injection Cell for Thin Film Electroplating H. Ortiz-Ibarra, J.A. Medina |
410 |
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41. Electrochemical Deposition of Nanocomposite Soft Magnetic Materials I. Shao, P.M. Vereecken, P.C. Searson, C.L. Chien, R.C. Cammarata |
420 |
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42. Electrochemical Deposition of Bi on GaAs P.M. Vereecken, P.C. Searson |
431 |
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Section VI Magnetic MEMS |
441 |
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43. Hybrid Technologies for Micromachined Magnetic Devices M.A.M. Gijs, F. Amalou, M. Saidani, E. Bornand |
443 |
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44. Integrated Ferromagnetic Microsensors and Microactuators J.W. Judy, H. Yang, N.V. Myung, C.-K. Yang, M. Schwartz, K. Nobe |
456 |
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45. A Magnetic Flexible Membrane Actuator for Micro Fluid Pumping C. Liu |
469 |
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46. Latching Micro Magnetic Relays M. Ruan, J. Shen, C.B. Wheeler |
485 |
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47. Electroplated Co-Ni-Mn-P-Based Hard Magnetic Arrays and Their Applications to Microactuators H.J. Cho, C.H. Ahn |
495 |
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48. Electrodeposited Hard Magnetic Thin Films for MEMS Applications N.V. Myung, D.Y. Park, M. Schwartz, K. Nobe, H. Yang, C.-K. Yang, J.W. Judy |
506 |
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49. Effects of Annealing on the Residual Stress and Bending in Sputtered Thin Films of Giant Magnetostrictive Alloys S.M. Na, S.J. Suh, J.M. Jung, H.J. Kim, S.H. Lim |
521 |
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50. Applications of Integrated Micromagnetic Devices at High Frequencies M. Yamaguchi, K.I. Arai |
536 |
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51. AC and DC Current Dependence of On-Chip Inductors E. Wesseling, E. Brandon, U. Lieneweg, R. Rub, S. Gupta, T.C. Nam, C.H. Ahn |
547 |
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52. Microinductors for Spacecraft Power Electronics E. Brandon, E. Wesseling, V. White, U. Lieneweg, H. Cherry, J. Podosek, A. Hernandez-Pellerano |
559 |
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53. Fully Integrated Magnetic Components for Wireless Communications J.Y. Park |
568 |
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54. Post-CMOS Integrated Planar Inductors for Monolilthic Power Management Chips T.M. Liakopoulos, R.W. Filas, A. Lotfi |
580 |
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55. Magneto-Impedance and Domain Structure of Micropatterned Amorphous Magnetic Ribbons F. Amalou, X. Houriet, E.L. Bornand, M.A.M. Gijs |
592 |
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| 56. Electrical Energy Monitoring Via Silicon Hall Effect Devices S.K. Gamage, H.T. Henderson |
600 |
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Section VII Author Index and Key Word Index |
611 |
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| Author Index |
613 |
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| Key Word Index |
615 |
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